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Vicor's Key Product Attributes and Compatible Power System Architectures
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Since the introduction of the DC-DC converter “brick” in 1982, Vicor has advanced power component paradigms that enable our customers to design power system solutions meeting their unique requirements with standard off-the-shelf building blocks.
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| Considerable investment in R&D has led to products that represent three distinct types of power components: |
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Brick Products
With an area of 3.3 in2 to 10.1 in2 and a height of 0.50 in., brick products are designed for through-hole mounting to a customer’s PCB with flexible thermal management, including a wide range of
heat-sink options. |
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V•I Chip Products
With an area of 0.5 in2 to 2 in2 and a height of 0.265 in., V•I Chip products are designed to surface mount on a customer’s board with power density up to 1.5 kW per in3 and current density
up to 110 A per in2. |
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Picor Products
With an area of 0.05 in2 to1 in2 and a height less than 0.25 in., silicon-based Picor products are designed to surface mount on a customer’s board and provide high density power conversion and power management functions. |
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Key Attributes
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Brick
Products
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V•I Chip
Products
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Picor
Products
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Typical Mounting
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Through-hole,
pin connections
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Surface Mount,
J Lead
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Surface Mount,
LGA
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Thermal Management
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Base-plate
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Case and PCB
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Case and PCB
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Package Height
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0.5 in
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0.265 in
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< 0.25 in
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Power Density
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Up to 145 W / in3
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Up to 1.5 kW / in3
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Up to 1 kW / in3
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Package Area
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3.3 in2 to 10.1 in2
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0.5 in2 to 2 in2
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0.05 in2 to 1 in2
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21 cm2 to 65 cm2
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3.3 cm2 to 13 cm2
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0.33 cm2 to 6.4 cm2
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| These power component paradigms support the power system architecture of your choice. The most efficient and cost-effective architecture often involves a combination of these power component paradigms. The following table illustrates the relationship between power system architectures and these products: |
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Power Systems Architectures
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Brick
Products
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V•I Chip
Products
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Picor
Products
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Distributed Power Architecture (DPA)
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AC-DC conversion
and filtering at front-end,
DC-DC conversion
at point of load,
Through-hole mount,
Base-plate cooling
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AC-DC conversion
and filtering at front-end, DC-DC conversion
at point of load,
Surface mount,
PCB/Heatsink cooling
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Filtering,
Power Management Functions,
DC-DC conversion
at point of load,
PCB/Heatsink cooling
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Intermediate Bus
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Bus Converters,
Through-hole mount,
Base-plate cooling
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Bus Converters,
Surface mount,
PCB/Heatsink cooling
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Filtering,
Power Management Functions,
DC-DC conversion
at point of load,
PCB/Heatsink cooling
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Factorized Power Architecture (FPA)
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VI Bricks provide POL Current Multiplication-Factorized Regulation, Through-hole mount,
Base-plate cooling
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V•I Chips provide POL Current Multiplication-Factorized Regulation, Surface mount,
PCB/Heatsink cooling
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Filtering,
Factorized Regulators, Power Management Functions,
Surface Mount,
PCB/Heatsink cooling
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| Contact us to help determine the best solution for your application – our Applications Engineers have decades of industry experience to help you find the most efficient, cost-effective solution for your power system needs. |
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