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| Features |
Industry Standard Eighth and Quarter Bricks High Efficiency: >98% High Density: 255 W/in² |
High Efficiency and High Power Density | High Efficiency and Thermally Enhanced | High Efficiency and High Power Density |
Very High Power Density |
High Efficiency and Thermally Enhanced | High Current Models |
High Power Broad Vout Trim Range |
Broad Selection and Current Source Module |
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| Input Voltage |
38 – 55 Vdc 36 – 60 Vdc |
18 – 75 Vdc Four Input Ranges |
18 – 75 Vdc Four Input Ranges |
38 – 55 Vdc / 330 – 400 Vdc Four Input Ranges |
36 - 75 18 - 36 41 - 57 Vdc |
38 – 55 Vdc / 330 – 400 Vdc Four Input Ranges |
36 – 75 Vdc One Input Range |
9 – 425 Vdc Eight Input Ranges |
10 – 400 Vdc Twelve Input Ranges |
| Output Voltage(s) |
4:1 and 5:1 fixed ratio 12 and 9.6 V at 48 Vin |
1.19 – 55 Vdc | 0.82 – 55 Vdc | 1.2 – 55 Vdc |
3.3 Vdc 12 Vdc 18 Vdc |
1 – 48 V | 1 – 48 Vdc | 2 – 54 Vdc | 2 – 95 Vdc |
| Power | 300 – 850 W | 120 – 400 W | 120 – 320 W | 120 – 325 W | 10 – 60 W | 135 – 325 W | 100 – 220 W | 50 – 600 W | 25 – 200 W |
| Package |
Eighth Brick, Open Frame 2.30" x 0.9" x 0.38" (58,4 x 22,9 x 9,53 mm) Quarter Brick, Open Frame 2.30" x 1.45" x 0.41" (58,4 x 36,8 x 10,5 mm) |
Full Chip 1.28" x 0.87" x 0.265" (32,5 x 22,0 x 6,73 mm) Half Chip 0.87" x 0.65" x 0.265" (22,0 x 16,5 x 6,73 mm) |
Full Size Flanged 1.91" x 1.09" x 0.37" (48,6 x 27,7 x 9,5 mm) |
Full Chip 1.28" x 0.87" x 0.265" (32,5 x 22,0 x 6,73 mm) Half Chip 0.87" x 0.65" x 0.265" (22,0 x 16,5 x 6,73 mm) |
Power System in Package (PSIP) 0.87" x 0.65" x 0.26" (22,0 x 16,5 x 6,73 mm) |
Full Size Flanged 1.91" x 1.09" x 0.37" (48,6 x 27,7 x 9,5 mm) |
Flanged baseplate (Height above board) 2.19" x 1.91" x 0.37" (55,7 x 48,6 x 9,5 mm) |
Maxi (Full Brick) 4.6" x 2.2" x 0.5’’ (117 x 55,9 mm) Mini (1/2 Brick) 2.28" x 2.2" x 0.5’’ (57,9 x 55,9 mm) Micro (1/4 Brick) 2.28" x 1.45" x 0.5’’ (57,9 x 36,8 mm) |
VI-200 (Full Brick): 4.6" x 2.4" x 0.5" (116,9 x 61,0 x 12,7 mm) VI-J00 (Half Brick): 2.28" x 2.4" x 0.5" (57,9 x 61,0 x 12,7 mm) |
| Mounting | Through Hole |
SMT or Through Hole Half Chip only SMT |
Through Hole |
SMT or Through Hole Half Chip only SMT |
SMT | Through Hole | Through Hole | Through Hole | Through Hole |
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| Features |
High Efficiency Thermally Enhanced MIL-STD- 810 Qualified |
High Power High Vout Trim Range MIL-STD-810 Qualification Environmental Stress Screening |
Broad Selection MIL_STD-810 Qualification Environmental Stress Screening |
High Efficiency MIL-STD-810 Qualification |
High Efficiency MIL-STD-810 Qualification MIL-STD-704 E/F Compliant |
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| Input Voltage |
VTM & PRM 16 – 50 Vdc BCM - 240 – 330 |
9 – 425 W Eight Input Ranges |
28 and 270 Vdc Inputs per MIL-STD-704D/E/F 155 Vdc Input per MIL-STD-1399A |
16 – 50 Vdc Input Range | 240 – 330 Vdc |
| Output Voltage(s) |
VTM & PRM 0.81 – 50 Vdc BCM - 30.0 – 41.25 Vdc |
2 – 54 Vdc | 2 – 48 Vdc | 0.81 – 30 Vdc | 30.0 – 41.25 Vdc |
| Power |
PRM & VTM 120 Watts BCM - 235 Watts |
50 – 600 W | 10 – 100 W | 414 W/in3 | 235 W |
| Package |
Full Size Flanged 1.91" x 1.09" x 0.37" (48,6 x 27,7 x 9,5 mm) |
Maxi (Full Brick) 4.6" x 2.2" x 0.5’’ (117 x 55,9 mm) Mini (1/2 Brick) 2.28" x 2.2" x 0.5’’ (57,9 x 55,9 mm) Micro (1/4 Brick) 2.28" x 1.45" x 0.5’’ (57,9 x 36,8 mm) |
MI-200 (Full Brick): 4.6" x 2.4" x 0.5" (116,9 x 61,0 x12,7 mm) MI-J00 (Half Brick): 2.28" x 2.4" x 0.5" (57,9 x 61,0 x 12,7 mm) |
Full Chip 1.28" x 0.87" x 0.265" (32,5 x 22,0 x 6,73 mm) |
Full Chip 1.28" x 0.87" x 0.265" (32,5 x 22,0 x 6,73 mm) |
| Mounting | Through Hole | Through Hole | Through Hole | SMT or Through Hole | SMT or Through Hole |