Dates and locations

17 September 2019

19 September 2019

2019 September 27

2019 October 2

2019 October 7 

Santa Clara
October 3, 2019

2019 October 10

2019 October 18

2019 October 23

2019 October 25

30 October 2019

Tel Aviv
13 November  2019




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Why you should attend this free event

Designing high-performance power systems continues to increase in complexity year after year. Utilizing a solid design methodology for high performance power conversion is essential to achieving first-time success. You will learn new techniques for EMI mitigation, thermal modeling, PCB Layout, DC-DC designs and implementing AC-DC Front ends. Real-world applications will be used whenever possible to illustrate the workshops.

During this daylong event you will learn from industry experts and Vicor applications engineers. They will help you identify common pitfalls and guide you on a path to success when designing high performance power systems.

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Workshops conducted by industry experts

Modular DC-DC system design done right

Real-world systems comprise more than just the DC-DC converter itself. Using a case study to examine the requirements of module integration into a DC-DC system, you will learn topics such as input and output filtering, protections, compatibility with the source and load dynamics.

Avoiding common AC-DC design pitfalls 

Design-in of AC-DC front end modules can be complicated. This session will provide a straightforward approach for success, covering such topics as source impedance considerations, inrush current, filter resonance and damping, PFC, faults, fusing, system stability and safety.

EMI challenges and troubleshooting techniques

Without proper consideration, EMI can derail projects and create costly delays. With a real-world troubleshooting example, you will learn about basic EMI measurement, common and differential noise sources and identification methods, conducted EMI pre-compliance testing, layout issues, etc.

High-performance PCB layout and thermal design techniques

Our experts will share their optimization techniques addressing the following topics: applying thermal models and simulation, PCB layout for effective thermal management, power/signal routing and integrity in high density, high current applications to minimize board losses and maximize performance.

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This event is a professional seminar with limited seats.
Your company information is required for your registration. 
Limit five (5) attendees from each company.

* Indicates required field